HARRIS SCPF4

Soldering Flux

Stay-Clean® Paste Flux

• 2-15% Ethylene Glycol, 30-80% Petroleum,
  1-10% Ammonium Chloride, 1-10% Water, 5-30% Zinc Chloride
• Designed primarily for copper to
  copper and copper to brass connections
• Ideal for soldering tube joints
• Works well with most leaded
  and lead-free solder compositions
• Not recommended for electrical or electronic
  applications due to potential corrosive residue of the flux
• Effective temperature range: Up to 600°F (316°C)
• Meets Commercial Specification A-A51145D Type 1 Form A,
  O-F-506 Type 1 form A (canceled 1/09/87)
• Made in the USA